Global IC Package Substrate Market 2017 Size, Share, Forecasts to 2022

Published On: Aug 2017

Format: PDF

Publisher: QY Research

Pages: 123

Report ID: 106625

Notes:
Production, means the output of IC Package Substrate
Revenue, means the sales value of IC Package Substrate

This report studies IC Package Substrate in Global market, especially in North America, Europe, China, Japan, Southeast Asia and India, focuses on top manufacturers in global market, with capacity, production, price, revenue and market share for each manufacturer, covering
Honeywell ACI
IBM
Unimicron
Multek
AT&S
Aspocomp
JCI(MGC)
Hitachi?Cable
Ibiden
Samsung
Shinko
Market Segment by Regions, this report splits Global into several key Regions, with production, consumption, revenue, market share and growth rate of IC Package Substrate in these regions, from 2011 to 2021 (forecast), like
North America
Europe
China
Japan
Southeast Asia
India
Split by product type, with production, revenue, price, market share and growth rate of each type, can be divided into
Ball Grid Array(BGA)
Chip Scale Package/Chip Size Package(CSP)
Flip Chip(FC)
Split by application, this report focuses on consumption, market share and growth rate of IC Package Substrate in each application, can be divided into
Mobile Telephone
PC
Camera
Others

Table of Contents

Global IC Package Substrate Market Research Report 2017
1 IC Package Substrate Market Overview
1.1 Product Overview and Scope of IC Package Substrate
1.2 IC Package Substrate Segment by Type
1.2.1 Global Production Market Share of IC Package Substrate by Type in 2015
1.2.2 Ball Grid Array(BGA)
1.2.3 Chip Scale Package/Chip Size Package(CSP)
1.2.4 Flip Chip(FC)
1.3 IC Package Substrate Segment by Application
1.3.1 IC Package Substrate Consumption Market Share by Application in 2015
1.3.2 Mobile Telephone
1.3.3 PC
1.3.4 Camera
1.3.5 Others
1.4 IC Package Substrate Market by Region
1.4.1 North America Status and Prospect (2012-2022)
1.4.2 Europe Status and Prospect (2012-2022)
1.4.3 China Status and Prospect (2012-2022)
1.4.4 Japan Status and Prospect (2012-2022)
1.4.5 Southeast Asia Status and Prospect (2012-2022)
1.4.6 India Status and Prospect (2012-2022)
1.5 Global Market Size (Value) of IC Package Substrate (2012-2022)

2 Global IC Package Substrate Market Competition by Manufacturers
2.1 Global IC Package Substrate Production and Share by Manufacturers (2015 and 2016)
2.2 Global IC Package Substrate Revenue and Share by Manufacturers (2015 and 2016)
2.3 Global IC Package Substrate Average Price by Manufacturers (2015 and 2016)
2.4 Manufacturers IC Package Substrate Manufacturing Base Distribution, Sales Area and Product Type
2.5 IC Package Substrate Market Competitive Situation and Trends
2.5.1 IC Package Substrate Market Concentration Rate
2.5.2 IC Package Substrate Market Share of Top 3 and Top 5 Manufacturers
2.5.3 Mergers & Acquisitions, Expansion

3 Global IC Package Substrate Production, Revenue (Value) by Region (2012-2017)
3.1 Global IC Package Substrate Production by Region (2012-2017)
3.2 Global IC Package Substrate Production Market Share by Region (2012-2017)
3.3 Global IC Package Substrate Revenue (Value) and Market Share by Region (2012-2017)
3.4 Global IC Package Substrate Production, Revenue, Price and Gross Margin (2012-2017)
3.5 North America IC Package Substrate Production, Revenue, Price and Gross Margin (2012-2017)
3.6 Europe IC Package Substrate Production, Revenue, Price and Gross Margin (2012-2017)
3.7 China IC Package Substrate Production, Revenue, Price and Gross Margin (2012-2017)
3.8 Japan IC Package Substrate Production, Revenue, Price and Gross Margin (2012-2017)
3.9 Southeast Asia IC Package Substrate Production, Revenue, Price and Gross Margin (2012-2017)
3.10 India IC Package Substrate Production, Revenue, Price and Gross Margin (2012-2017)

4 Global IC Package Substrate Supply (Production), Consumption, Export, Import by Regions (2012-2017)
4.1 Global IC Package Substrate Consumption by Regions (2012-2017)
4.2 North America IC Package Substrate Production, Consumption, Export, Import (2012-2017)
4.3 Europe IC Package Substrate Production, Consumption, Export, Import (2012-2017)
4.4 China IC Package Substrate Production, Consumption, Export, Import (2012-2017)
4.5 Japan IC Package Substrate Production, Consumption, Export, Import (2012-2017)
4.6 Southeast Asia IC Package Substrate Production, Consumption, Export, Import (2012-2017)
4.7 India IC Package Substrate Production, Consumption, Export, Import (2012-2017)

5 Global IC Package Substrate Production, Revenue (Value), Price Trend by Type
5.1 Global IC Package Substrate Production and Market Share by Type (2012-2017)
5.2 Global IC Package Substrate Revenue and Market Share by Type (2012-2017)
5.3 Global IC Package Substrate Price by Type (2012-2017)
5.4 Global IC Package Substrate Production Growth by Type (2012-2017)

6 Global IC Package Substrate Market Analysis by Application
6.1 Global IC Package Substrate Consumption and Market Share by Application (2012-2017)
6.2 Global IC Package Substrate Consumption Growth Rate by Application (2012-2017)
6.3 Market Drivers and Opportunities
6.3.1 Potential Applications
6.3.2 Emerging Markets/Countries

7 Global IC Package Substrate Manufacturers Profiles/Analysis
7.1 Honeywell ACI
7.1.1 Company Basic Information, Manufacturing Base and Its Competitors
7.1.2 IC Package Substrate Product Type, Application and Specification
7.1.2.1 Ball Grid Array(BGA)
7.1.2.2 Chip Scale Package/Chip Size Package(CSP)
7.1.3 Honeywell ACI IC Package Substrate Production, Revenue, Price and Gross Margin (2015 and 2016)
7.1.4 Main Business/Business Overview
7.2 IBM
7.2.1 Company Basic Information, Manufacturing Base and Its Competitors
7.2.2 IC Package Substrate Product Type, Application and Specification
7.2.2.1 Ball Grid Array(BGA)
7.2.2.2 Chip Scale Package/Chip Size Package(CSP)
7.2.3 IBM IC Package Substrate Production, Revenue, Price and Gross Margin (2015 and 2016)
7.2.4 Main Business/Business Overview
7.3 Unimicron
7.3.1 Company Basic Information, Manufacturing Base and Its Competitors
7.3.2 IC Package Substrate Product Type, Application and Specification
7.3.2.1 Ball Grid Array(BGA)
7.3.2.2 Chip Scale Package/Chip Size Package(CSP)
7.3.3 Unimicron IC Package Substrate Production, Revenue, Price and Gross Margin (2015 and 2016)
7.3.4 Main Business/Business Overview
7.4 Multek
7.4.1 Company Basic Information, Manufacturing Base and Its Competitors
7.4.2 IC Package Substrate Product Type, Application and Specification
7.4.2.1 Ball Grid Array(BGA)
7.4.2.2 Chip Scale Package/Chip Size Package(CSP)
7.4.3 Multek IC Package Substrate Production, Revenue, Price and Gross Margin (2015 and 2016)
7.4.4 Main Business/Business Overview
7.5 AT&S
7.5.1 Company Basic Information, Manufacturing Base and Its Competitors
7.5.2 IC Package Substrate Product Type, Application and Specification
7.5.2.1 Ball Grid Array(BGA)
7.5.2.2 Chip Scale Package/Chip Size Package(CSP)
7.5.3 AT&S IC Package Substrate Production, Revenue, Price and Gross Margin (2015 and 2016)
7.5.4 Main Business/Business Overview
7.6 Aspocomp
7.6.1 Company Basic Information, Manufacturing Base and Its Competitors
7.6.2 IC Package Substrate Product Type, Application and Specification
7.6.2.1 Ball Grid Array(BGA)
7.6.2.2 Chip Scale Package/Chip Size Package(CSP)
7.6.3 Aspocomp IC Package Substrate Production, Revenue, Price and Gross Margin (2015 and 2016)
7.6.4 Main Business/Business Overview
7.7 JCI(MGC)
7.7.1 Company Basic Information, Manufacturing Base and Its Competitors
7.7.2 IC Package Substrate Product Type, Application and Specification
7.7.2.1 Ball Grid Array(BGA)
7.7.2.2 Chip Scale Package/Chip Size Package(CSP)
7.7.3 JCI(MGC) IC Package Substrate Production, Revenue, Price and Gross Margin (2015 and 2016)
7.7.4 Main Business/Business Overview
7.8 Hitachi?Cable
7.8.1 Company Basic Information, Manufacturing Base and Its Competitors
7.8.2 IC Package Substrate Product Type, Application and Specification
7.8.2.1 Ball Grid Array(BGA)
7.8.2.2 Chip Scale Package/Chip Size Package(CSP)
7.8.3 Hitachi?Cable IC Package Substrate Production, Revenue, Price and Gross Margin (2015 and 2016)
7.8.4 Main Business/Business Overview
7.9 Ibiden
7.9.1 Company Basic Information, Manufacturing Base and Its Competitors
7.9.2 IC Package Substrate Product Type, Application and Specification
7.9.2.1 Ball Grid Array(BGA)
7.9.2.2 Chip Scale Package/Chip Size Package(CSP)
7.9.3 Ibiden IC Package Substrate Production, Revenue, Price and Gross Margin (2015 and 2016)
7.9.4 Main Business/Business Overview
7.10 Samsung
7.10.1 Company Basic Information, Manufacturing Base and Its Competitors
7.10.2 IC Package Substrate Product Type, Application and Specification
7.10.2.1 Ball Grid Array(BGA)
7.10.2.2 Chip Scale Package/Chip Size Package(CSP)
7.10.3 Samsung IC Package Substrate Production, Revenue, Price and Gross Margin (2015 and 2016)
7.10.4 Main Business/Business Overview
7.11 Shinko

8 IC Package Substrate Manufacturing Cost Analysis
8.1 IC Package Substrate Key Raw Materials Analysis
8.1.1 Key Raw Materials
8.1.2 Price Trend of Key Raw Materials
8.1.3 Key Suppliers of Raw Materials
8.1.4 Market Concentration Rate of Raw Materials
8.2 Proportion of Manufacturing Cost Structure
8.2.1 Raw Materials
8.2.2 Labor Cost
8.2.3 Manufacturing Expenses
8.3 Manufacturing Process Analysis of IC Package Substrate

9 Industrial Chain, Sourcing Strategy and Downstream Buyers
9.1 IC Package Substrate Industrial Chain Analysis
9.2 Upstream Raw Materials Sourcing
9.3 Raw Materials Sources of IC Package Substrate Major Manufacturers in 2015
9.4 Downstream Buyers

10 Marketing Strategy Analysis, Distributors/Traders
10.1 Marketing Channel
10.1.1 Direct Marketing
10.1.2 Indirect Marketing
10.1.3 Marketing Channel Development Trend
10.2 Market Positioning
10.2.1 Pricing Strategy
10.2.2 Brand Strategy
10.2.3 Target Client
10.3 Distributors/Traders List

11 Market Effect Factors Analysis
11.1 Technology Progress/Risk
11.1.1 Substitutes Threat
11.1.2 Technology Progress in Related Industry
11.2 Consumer Needs/Customer Preference Change
11.3 Economic/Political Environmental Change

12 Global IC Package Substrate Market Forecast (2017-2022)
12.1 Global IC Package Substrate Production, Revenue and Price Forecast (2017-2022)
12.1.1 Global IC Package Substrate Production and Growth Rate Forecast (2017-2022)
12.1.2 Global IC Package Substrate Revenue and Growth Rate Forecast (2017-2022)
12.1.3 Global IC Package Substrate Price and Trend Forecast (2017-2022)
12.2 Global IC Package Substrate Production, Consumption , Import and Export Forecast by Regions (2017-2022)
12.2.1 North America IC Package Substrate Production, Revenue, Consumption, Export and Import Forecast (2017-2022)
12.2.2 Europe IC Package Substrate Production, Revenue, Consumption, Export and Import Forecast (2017-2022)
12.2.3 China IC Package Substrate Production, Revenue, Consumption, Export and Import Forecast (2017-2022)
12.2.4 Japan IC Package Substrate Production, Revenue, Consumption, Export and Import Forecast (2017-2022)
12.2.5 Southeast Asia IC Package Substrate Production, Revenue, Consumption, Export and Import Forecast (2017-2022)
12.2.6 India IC Package Substrate Production, Revenue, Consumption, Export and Import Forecast (2017-2022)
12.3 Global IC Package Substrate Production, Revenue and Price Forecast by Type (2017-2022)
12.4 Global IC Package Substrate Consumption Forecast by Application (2017-2022)

13 Research Findings and Conclusion

14 Appendix
Methodology
Analyst Introduction
Data Source