Global Semiconductor Packaging and Assembly Equipment Market Research Report 2017-2022

Published On: Aug 2017

Format: PDF

Publisher: QY Research

Pages: 107

Report ID: 109109

In this report, the global Semiconductor Packaging and Assembly Equipment market is valued at USD XX million in 2016 and is expected to reach USD XX million by the end of 2022, growing at a CAGR of XX% between 2016 and 2022.

Geographically, this report is segmented into several key Regions, with production, consumption, revenue (million USD), market share and growth rate of Semiconductor Packaging and Assembly Equipment in these regions, from 2012 to 2022 (forecast), covering
North America
Europe
China
Japan
Southeast Asia
India
Global Semiconductor Packaging and Assembly Equipment market competition by top manufacturers, with production, price, revenue (value) and market share for each manufacturer; the top players including
Applied Materials
ASM Pacific Technology (ASMPT)
Disco
EV Group (EVG)
Kulicke and Soffa Industries
Tokyo Electron
Tokyo Seimitsu
Rudolph Technologies
SEMES
Suss Microtec
On the basis of product, this report displays the production, revenue, price, market share and growth rate of each type, primarily split into
Die-Level Packaging and Assembly Equipment
Wafer-Level Packaging and Assembly Equipment
On the basis on the end users/applications, this report focuses on the status and outlook for major applications/end users, consumption (sales), market share and growth rate of Semiconductor Packaging and Assembly Equipment for each application, including
Consumer Electronics
Automobile
Medical Care
Others

Table of Contents

Global Semiconductor Packaging and Assembly Equipment Market Research Report 2017
1 Semiconductor Packaging and Assembly Equipment Market Overview
1.1 Product Overview and Scope of Semiconductor Packaging and Assembly Equipment
1.2 Semiconductor Packaging and Assembly Equipment Segment by Type (Product Category)
1.2.1 Global Semiconductor Packaging and Assembly Equipment Production and CAGR (%) Comparison by Type (Product Category) (2012-2022)
1.2.2 Global Semiconductor Packaging and Assembly Equipment Production Market Share by Type (Product Category) in 2016
1.2.3 Die-Level Packaging and Assembly Equipment
1.2.4 Wafer-Level Packaging and Assembly Equipment
1.3 Global Semiconductor Packaging and Assembly Equipment Segment by Application
1.3.1 Semiconductor Packaging and Assembly Equipment Consumption (Sales) Comparison by Application (2012-2022)
1.3.2 Consumer Electronics
1.3.3 Automobile
1.3.4 Medical Care
1.3.5 Others
1.4 Global Semiconductor Packaging and Assembly Equipment Market by Region (2012-2022)
1.4.1 Global Semiconductor Packaging and Assembly Equipment Market Size (Value) and CAGR (%) Comparison by Region (2012-2022)
1.4.2 North America Status and Prospect (2012-2022)
1.4.3 Europe Status and Prospect (2012-2022)
1.4.4 China Status and Prospect (2012-2022)
1.4.5 Japan Status and Prospect (2012-2022)
1.4.6 Southeast Asia Status and Prospect (2012-2022)
1.4.7 India Status and Prospect (2012-2022)
1.5 Global Market Size (Value) of Semiconductor Packaging and Assembly Equipment (2012-2022)
1.5.1 Global Semiconductor Packaging and Assembly Equipment Revenue Status and Outlook (2012-2022)
1.5.2 Global Semiconductor Packaging and Assembly Equipment Capacity, Production Status and Outlook (2012-2022)

2 Global Semiconductor Packaging and Assembly Equipment Market Competition by Manufacturers
2.1 Global Semiconductor Packaging and Assembly Equipment Capacity, Production and Share by Manufacturers (2012-2017)
2.1.1 Global Semiconductor Packaging and Assembly Equipment Capacity and Share by Manufacturers (2012-2017)
2.1.2 Global Semiconductor Packaging and Assembly Equipment Production and Share by Manufacturers (2012-2017)
2.2 Global Semiconductor Packaging and Assembly Equipment Revenue and Share by Manufacturers (2012-2017)
2.3 Global Semiconductor Packaging and Assembly Equipment Average Price by Manufacturers (2012-2017)
2.4 Manufacturers Semiconductor Packaging and Assembly Equipment Manufacturing Base Distribution, Sales Area and Product Type
2.5 Semiconductor Packaging and Assembly Equipment Market Competitive Situation and Trends
2.5.1 Semiconductor Packaging and Assembly Equipment Market Concentration Rate
2.5.2 Semiconductor Packaging and Assembly Equipment Market Share of Top 3 and Top 5 Manufacturers
2.5.3 Mergers & Acquisitions, Expansion

3 Global Semiconductor Packaging and Assembly Equipment Capacity, Production, Revenue (Value) by Region (2012-2017)
3.1 Global Semiconductor Packaging and Assembly Equipment Capacity and Market Share by Region (2012-2017)
3.2 Global Semiconductor Packaging and Assembly Equipment Production and Market Share by Region (2012-2017)
3.3 Global Semiconductor Packaging and Assembly Equipment Revenue (Value) and Market Share by Region (2012-2017)
3.4 Global Semiconductor Packaging and Assembly Equipment Capacity, Production, Revenue, Price and Gross Margin (2012-2017)
3.5 North America Semiconductor Packaging and Assembly Equipment Capacity, Production, Revenue, Price and Gross Margin (2012-2017)
3.6 Europe Semiconductor Packaging and Assembly Equipment Capacity, Production, Revenue, Price and Gross Margin (2012-2017)
3.7 China Semiconductor Packaging and Assembly Equipment Capacity, Production, Revenue, Price and Gross Margin (2012-2017)
3.8 Japan Semiconductor Packaging and Assembly Equipment Capacity, Production, Revenue, Price and Gross Margin (2012-2017)
3.9 Southeast Asia Semiconductor Packaging and Assembly Equipment Capacity, Production, Revenue, Price and Gross Margin (2012-2017)
3.10 India Semiconductor Packaging and Assembly Equipment Capacity, Production, Revenue, Price and Gross Margin (2012-2017)

4 Global Semiconductor Packaging and Assembly Equipment Supply (Production), Consumption, Export, Import by Region (2012-2017)
4.1 Global Semiconductor Packaging and Assembly Equipment Consumption by Region (2012-2017)
4.2 North America Semiconductor Packaging and Assembly Equipment Production, Consumption, Export, Import (2012-2017)
4.3 Europe Semiconductor Packaging and Assembly Equipment Production, Consumption, Export, Import (2012-2017)
4.4 China Semiconductor Packaging and Assembly Equipment Production, Consumption, Export, Import (2012-2017)
4.5 Japan Semiconductor Packaging and Assembly Equipment Production, Consumption, Export, Import (2012-2017)
4.6 Southeast Asia Semiconductor Packaging and Assembly Equipment Production, Consumption, Export, Import (2012-2017)
4.7 India Semiconductor Packaging and Assembly Equipment Production, Consumption, Export, Import (2012-2017)

5 Global Semiconductor Packaging and Assembly Equipment Production, Revenue (Value), Price Trend by Type
5.1 Global Semiconductor Packaging and Assembly Equipment Production and Market Share by Type (2012-2017)
5.2 Global Semiconductor Packaging and Assembly Equipment Revenue and Market Share by Type (2012-2017)
5.3 Global Semiconductor Packaging and Assembly Equipment Price by Type (2012-2017)
5.4 Global Semiconductor Packaging and Assembly Equipment Production Growth by Type (2012-2017)

6 Global Semiconductor Packaging and Assembly Equipment Market Analysis by Application
6.1 Global Semiconductor Packaging and Assembly Equipment Consumption and Market Share by Application (2012-2017)
6.2 Global Semiconductor Packaging and Assembly Equipment Consumption Growth Rate by Application (2012-2017)
6.3 Market Drivers and Opportunities
6.3.1 Potential Applications
6.3.2 Emerging Markets/Countries

7 Global Semiconductor Packaging and Assembly Equipment Manufacturers Profiles/Analysis
7.1 Applied Materials
7.1.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors
7.1.2 Semiconductor Packaging and Assembly Equipment Product Category, Application and Specification
7.1.2.1 Product A
7.1.2.2 Product B
7.1.3 Applied Materials Semiconductor Packaging and Assembly Equipment Capacity, Production, Revenue, Price and Gross Margin (2012-2017)
7.1.4 Main Business/Business Overview
7.2 ASM Pacific Technology (ASMPT)
7.2.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors
7.2.2 Semiconductor Packaging and Assembly Equipment Product Category, Application and Specification
7.2.2.1 Product A
7.2.2.2 Product B
7.2.3 ASM Pacific Technology (ASMPT) Semiconductor Packaging and Assembly Equipment Capacity, Production, Revenue, Price and Gross Margin (2012-2017)
7.2.4 Main Business/Business Overview
7.3 Disco
7.3.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors
7.3.2 Semiconductor Packaging and Assembly Equipment Product Category, Application and Specification
7.3.2.1 Product A
7.3.2.2 Product B
7.3.3 Disco Semiconductor Packaging and Assembly Equipment Capacity, Production, Revenue, Price and Gross Margin (2012-2017)
7.3.4 Main Business/Business Overview
7.4 EV Group (EVG)
7.4.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors
7.4.2 Semiconductor Packaging and Assembly Equipment Product Category, Application and Specification
7.4.2.1 Product A
7.4.2.2 Product B
7.4.3 EV Group (EVG) Semiconductor Packaging and Assembly Equipment Capacity, Production, Revenue, Price and Gross Margin (2012-2017)
7.4.4 Main Business/Business Overview
7.5 Kulicke and Soffa Industries
7.5.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors
7.5.2 Semiconductor Packaging and Assembly Equipment Product Category, Application and Specification
7.5.2.1 Product A
7.5.2.2 Product B
7.5.3 Kulicke and Soffa Industries Semiconductor Packaging and Assembly Equipment Capacity, Production, Revenue, Price and Gross Margin (2012-2017)
7.5.4 Main Business/Business Overview
7.6 Tokyo Electron
7.6.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors
7.6.2 Semiconductor Packaging and Assembly Equipment Product Category, Application and Specification
7.6.2.1 Product A
7.6.2.2 Product B
7.6.3 Tokyo Electron Semiconductor Packaging and Assembly Equipment Capacity, Production, Revenue, Price and Gross Margin (2012-2017)
7.6.4 Main Business/Business Overview
7.7 Tokyo Seimitsu
7.7.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors
7.7.2 Semiconductor Packaging and Assembly Equipment Product Category, Application and Specification
7.7.2.1 Product A
7.7.2.2 Product B
7.7.3 Tokyo Seimitsu Semiconductor Packaging and Assembly Equipment Capacity, Production, Revenue, Price and Gross Margin (2012-2017)
7.7.4 Main Business/Business Overview
7.8 Rudolph Technologies
7.8.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors
7.8.2 Semiconductor Packaging and Assembly Equipment Product Category, Application and Specification
7.8.2.1 Product A
7.8.2.2 Product B
7.8.3 Rudolph Technologies Semiconductor Packaging and Assembly Equipment Capacity, Production, Revenue, Price and Gross Margin (2012-2017)
7.8.4 Main Business/Business Overview
7.9 SEMES
7.9.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors
7.9.2 Semiconductor Packaging and Assembly Equipment Product Category, Application and Specification
7.9.2.1 Product A
7.9.2.2 Product B
7.9.3 SEMES Semiconductor Packaging and Assembly Equipment Capacity, Production, Revenue, Price and Gross Margin (2012-2017)
7.9.4 Main Business/Business Overview
7.10 Suss Microtec
7.10.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors
7.10.2 Semiconductor Packaging and Assembly Equipment Product Category, Application and Specification
7.10.2.1 Product A
7.10.2.2 Product B
7.10.3 Suss Microtec Semiconductor Packaging and Assembly Equipment Capacity, Production, Revenue, Price and Gross Margin (2012-2017)
7.10.4 Main Business/Business Overview

8 Semiconductor Packaging and Assembly Equipment Manufacturing Cost Analysis
8.1 Semiconductor Packaging and Assembly Equipment Key Raw Materials Analysis
8.1.1 Key Raw Materials
8.1.2 Price Trend of Key Raw Materials
8.1.3 Key Suppliers of Raw Materials
8.1.4 Market Concentration Rate of Raw Materials
8.2 Proportion of Manufacturing Cost Structure
8.2.1 Raw Materials
8.2.2 Labor Cost
8.2.3 Manufacturing Expenses
8.3 Manufacturing Process Analysis of Semiconductor Packaging and Assembly Equipment

9 Industrial Chain, Sourcing Strategy and Downstream Buyers
9.1 Semiconductor Packaging and Assembly Equipment Industrial Chain Analysis
9.2 Upstream Raw Materials Sourcing
9.3 Raw Materials Sources of Semiconductor Packaging and Assembly Equipment Major Manufacturers in 2015
9.4 Downstream Buyers

10 Marketing Strategy Analysis, Distributors/Traders
10.1 Marketing Channel
10.1.1 Direct Marketing
10.1.2 Indirect Marketing
10.1.3 Marketing Channel Development Trend
10.2 Market Positioning
10.2.1 Pricing Strategy
10.2.2 Brand Strategy
10.2.3 Target Client
10.3 Distributors/Traders List

11 Market Effect Factors Analysis
11.1 Technology Progress/Risk
11.1.1 Substitutes Threat
11.1.2 Technology Progress in Related Industry
11.2 Consumer Needs/Customer Preference Change
11.3 Economic/Political Environmental Change

12 Global Semiconductor Packaging and Assembly Equipment Market Forecast (2017-2022)
12.1 Global Semiconductor Packaging and Assembly Equipment Capacity, Production, Revenue Forecast (2017-2022)
12.1.1 Global Semiconductor Packaging and Assembly Equipment Capacity, Production and Growth Rate Forecast (2017-2022)
12.1.2 Global Semiconductor Packaging and Assembly Equipment Revenue and Growth Rate Forecast (2017-2022)
12.1.3 Global Semiconductor Packaging and Assembly Equipment Price and Trend Forecast (2017-2022)
12.2 Global Semiconductor Packaging and Assembly Equipment Production, Consumption , Import and Export Forecast by Region (2017-2022)
12.2.1 North America Semiconductor Packaging and Assembly Equipment Production, Revenue, Consumption, Export and Import Forecast (2017-2022)
12.2.2 Europe Semiconductor Packaging and Assembly Equipment Production, Revenue, Consumption, Export and Import Forecast (2017-2022)
12.2.3 China Semiconductor Packaging and Assembly Equipment Production, Revenue, Consumption, Export and Import Forecast (2017-2022)
12.2.4 Japan Semiconductor Packaging and Assembly Equipment Production, Revenue, Consumption, Export and Import Forecast (2017-2022)
12.2.5 Southeast Asia Semiconductor Packaging and Assembly Equipment Production, Revenue, Consumption, Export and Import Forecast (2017-2022)
12.2.6 India Semiconductor Packaging and Assembly Equipment Production, Revenue, Consumption, Export and Import Forecast (2017-2022)
12.3 Global Semiconductor Packaging and Assembly Equipment Production, Revenue and Price Forecast by Type (2017-2022)
12.4 Global Semiconductor Packaging and Assembly Equipment Consumption Forecast by Application (2017-2022)

13 Research Findings and Conclusion

14 Appendix
14.1 Methodology/Research Approach
14.1.1 Research Programs/Design
14.1.2 Market Size Estimation
14.1.3 Market Breakdown and Data Triangulation
14.2 Data Source
14.2.1 Secondary Sources
14.2.2 Primary Sources
14.3 Disclaimer